FOCUSTECH™ Solutions
About FOCUSTECH™
We are a world-class chemical manufacturer that also happens to manufacture the industry-leading line of process control systems.
We create custom formulations to meet customer or supplier requirements. Primarily servicing the PCB, GMF, and Chem Milling industries.
Beyond our well-established stable of existing products, we take pride in our ability to quickly and effectively formulate custom products for customer-specific applications.
Adhesion Promoters
Copper surface treatment designed to promote excellent dry film adhesion after electroless copper processing. AT-24 neutralizes the copper surface and deposits a uniform triazole film to help preserve surface quality for subsequent processing, with added protection against copper oxidation prior to lamination.
A highly concentrated, acid cleaner designed to completely remove chromate conversion coatings and improve dry film photoresist adhesion. PC-1531 removes light oils and fingerprints and leaves the copper surface resistant to oxidation.
Sprayable metal cleaner and adhesion promoter designed to improve dry film photoresist adhesion on smooth metal surfaces. PC-1532 removes chromate conversion coatings, light oils, and fingerprints, then deposits an ultra-thin polymer coating to enhance adhesion and help protect the metal surface from oxidation prior to lamination.
Anti-Foam
A highly active surfactant that works at very low concentrations and is free rinsing. AF-5 is a high molecular weight block copolymer formulation that is the industry standard for dry film processing antifoams.
An outstanding antifoam that is exceptionally effective in photoresist developing and stripping applications.
Anti-Tarnish
Citric acid and triazole solution designed to prevent copper oxidation, improve dry film adhesion and preserve the surface for subsequent processing.
Triazole solution designed to prevent copper oxidation, improve dry film adhesion and preserve the surface for subsequent processing.
Copper anti-tarnish for pumice scrubber applications, designed to help prevent copper oxidation, preserve freshly prepared copper surfaces, and promote excellent dry film adhesion. AT-26 activates the copper surface and deposits a uniform triazole film for reliable adhesion performance in copper processing applications.
"Concentrated anti-tarnish designed to preserve cleaned copper surfaces and prevent re-oxidation prior to subsequent processing. Excellent non-flammable replacement for Cu-56."
Copper Cleaners
Alkaline cleaner designed to clean copper surfaces. ALC-1 completely removes resist residues, heavy oils and finger prints.
Non-etching, dual-acid cleaner formulated to completely remove conversion coatings as well as light oils and fingerprints.
Tri-acid cleaner with a very mild etch for removing conversion coatings, oxidation stains, light oils and fingerprints.
Dual-acid cleaner formulated specifically to provide improved dry film adhesion to Very Low Profile (VLP) copper foils, especially when used in conjunction with DuPont’s YieldMaster® 2000 Wet Lamination System.
Tri-acid cleaner formulated to provide improved dry film adhesion to Very Low Profile (VLP) copper foils, especially when used in conjunction with DuPont’s YieldMaster® 2000 Wet Lamination System. ILC-PF is phosphate-free for facilities with reduced or zero phosphate discharge limits.
Pre-plate cleaner that provides a mild and consistent etch rate over the life of the bath.
Copper Thinning/Half Etch
Hydrogen peroxide/sulfuric acid copper etching process designed to rapidly and evenly reduce copper foil thickness prior to fine line etching operations.
Copper reduction process for applications requiring rapid, uniform copper foil reduction prior to fine etching in HDI and BGA manufacturing. CR-2185 helps manufacturers achieve process-specific foil thickness targets while improving surface topography and providing a cost-effective alternative to thin foil laminates.
Cupric and Ferric Chloride Etch
Sodium chlorate/sodium chloride-based cupric and ferric chloride etchant regenerator formulated specifically for colorimetric control systems.
Sodium chlorate based cupric and ferric chloride etchant regenerator with proprietary banking agents that provide an improved etch factor.
Acidic equipment cleaner designed specifically to clean soot and residue from ferric chloride etching systems that process carbon steel.
Dry Film/LPI Developers
450 g/L developer concentrate designed for use in photoresist and solder mask developing processes. Formulated using detergent additives, working solutions of DV-6450 can be made using tap water with up to 400 ppm of dissolved solids without forming a significant hardness scale.
Concentrated developer solution designed specifically for replenishment of steady state developing processes. DV-6450R provides over three times the loading of standard carbonate developing processes without compromising product quality or throughput.
600 g/L potassium carbonate developer concentrate designed for use in photoresist and solder mask developing processes. DV-6600 contains cleaner additives that significantly reduce residue and water hardness scale buildup in the process equipment.
Dry Film Resist Stripper - Innerlayers
Cost effective caustic/MEA based photoresist stripper designed specifically for print-and-etch stripping applications.
Photoresist stripper designed for print-and-etch stripping applications, but it is also an excellent general-purpose stripper well suited for processes that run both inner and outer layer parts.
Very low VOC dry film stripper designed specifically for print-and-etch applications. FS-68/IL can significantly reduce VOC emissions.
Dry Film Resist Stripper - Outerlayers
Photoresist stripper formulated to break etch resist into very small piece sizes and aid in removal from fine and/or overplated features without the use of glycol ethers (solvents). Also available as a starter solution with a reduced pH to prevent tin attack during startup.
Semi-aqueous photoresist stripper formulated specifically to strip dry film from between very fine lines and underneath overplated features. No product on the market produces a smaller stripped particle than FS-79/OL.
Equipment Cleaner
Alkaline cleaner formulated for developing, etching, resist stripping and tin stripping processes.
Aggressive solvent/alkaline cleaner excellent for removing tenacious photoinitiator sludge and residues from dry film developing and stripping processes.
Mild organic acid cleaner designed to remove photoinitiator sludge from dry film developing and stripping processes.
Hot Air Solder Level & Hot Oil Reflow
Heat transfer fluid for use in immersion reflow of plated solder. HOR-210 has excellent thermal stability and is completely water soluble for easy rinsing.
Low acid hot oil reflow flux designed with superior wetting to provide excellent solder coverage with a bright, shiny finish.
Hydrochloric acid/thiourea-based solder brightener/conditioner designed for immersion or spray applications. SB-260 deoxidizes and brightens solder etch resists after etching and conditions the plated solder to provide superior reflow characteristics.
VHF-204 is a low-viscosity vertical solder leveling flux designed to remove light copper oxides and promote excellent solderability. Its solvent-free, non-foaming, free-rinsing formulation is compatible with LPI and dry film soldermasks and supports excellent surface ionic properties in vertical HASL applications.
VHF-206 is a low-viscosity vertical solder leveling flux formulated to remove light copper oxides and promote excellent solderability while helping reduce foaming in post-cleaning equipment. Its solvent-free formulation is compatible with LPI and dry film soldermasks, making it well suited for vertical HASL lines where cleaning performance and foam control are key considerations.
Micro-Etch
Catalysed peroxide/sulfuric microetch designed to provide a significantly rougher surface when compared to traditional peroxide/sulfuric microetches.
Stabilized powder persulfate microetch that simply outperforms all other proprietary powdered microetches.
Oxide Alternative
Super concentrated alternative oxide micro-etch additive designed to promote strong innerlayer bonding across a wide range of resin systems. Resin Bond 330 develops the desired copper surface with shorter dwell times and less copper removal, helping improve throughput while reducing operating cost through lower consumption.
Pumice
Acid-activated, 3F pumice that chemically removes copper oxidation and imparts anti-tarnish properties on the copper surface. AP-580 can be used in automatic or hand scrubbing operations.
Acid-activated, 3F pumice that chemically removes copper oxidation and imparts anti-tarnish properties on the copper surface. For use only in hand scrubbing operations.
Screening Products
Cured solder mask stripper is formulated to quickly and cleanly strip most cured solder masks with minimal effort. Typical cleaning cycles are less than one hour and require little to no scrubbing.
Free rinsing, biodegradable screen cleaner formulated to effectively remove uncured solder masks and legend inks from screens and parts.
Free rinsing, biodegradable screen cleaner that quickly removes uncured solder masks and legend inks from screens and parts.
Tin/Solder Strippers
High molecular weight anionic flocculant designed for the treatment of industrial wastewater. AUTOtreat AP-9250 promotes efficient flocculation across a wide pH range without altering water pH and can also be used as a coagulant aid in systems employing alum, iron salts, or other coagulants.
Reduced sludge tin stripper that quickly removes etch resists leaving a uniform surface with minimal copper attack.
High-loading tin stripper that removes etch resists quickly and cleanly and leaves the underlying copper surface with a bright, uniform finish.
High-loading ammonium bifluoride/hydrogen peroxide-based tin/solder
stripper.
Waste Treatment
Highly effective process antifoam for waste treatment applications where reliable foam control is needed at very low dosage rates. AF-20 is a free-rinsing, nonionic antifoam that helps control foam without adding excessive carryover, making it an economical choice for industrial wastewater systems.
Sodium dimethyl dithiocarbamate-based waste treatment additive for precipitating metal ions. MC-9210 provides a safe, cost-effective means for removing heavy metals from chelated and non-chelated waste streams.
Sulfide-free, proprietary waste treatment additive for precipitating heavy metal ions. MP-9220 reduces copper, tin, nickel, and lead to their pure metallic form resulting in dense filter cakes of very high metal concentrations with no risk of hydrogen sulfide gas releases.
Proprietary formulation designed to precipitate dry film photoresist from spent resist stripping solutions. RESIStreat RT-9225 detacifies precipitated resist sludge so that it is easily dewatered in a standard filter press.
Calcium polysulfide-based waste treatment additive for precipitating metal ions.