• 1999 Founded Automated Chemical Solutions in Tempe, Arizona with a passion to manufacture process chemicals and control systems ‘under one roof’ that work together to provide manufacturers with the most efficient processes available.
  • 2000 Started exporting products to Taiwan to service the chipset manufacturing market.
  • 2001 Introduced Resin Bond oxide alternative and CR-2180 copper reduction etchant (half etch) with great success in the Taiwanese chipset market.
  • 2002 Started manufacturing the Focus Tech brand exclusively for Insulectro.
  • Built our first CC-4000 cupric chloride etch controller becoming the first controller manufacturer in this market to incorporate toroidal conductivity measurement, a touch screen operator interface and expanded alarm systems to greatly improve process safety.
  • 2003 Custom formulated an outer layer resist stripper for Sanmina® that would allow dry film removal from plated fine line constructions and overplated features without the use of solvents thus changing the way the industry approached this challenge.
  • 2004 Purchased 18,000 square foot facility and moved manufacturing operations to Phoenix, Arizona.
  • 2009 Customed formulated a specialty cleaner for US Department of Defense subcontractor to facilitate the cleanup and decontamination of phosgene (mustard gas) munitions.
  • 2011 Signed an exclusive licensing agreement with PMD, LTD. to manufacture and market PMD’s complete line of general metal finishing products in North America: http://pmdchemicals.co.uk/
  • 2013  Acquired 10,000 square foot facility adjacent to our existing Phoenix facility to expand storage, shipping and receiving capacities.
  • 2014 Custom formulated a very low VOC inner layer resist stripper for TTM® Santa Ana that allowed the facility to dramatically reduce VOC emissions without compromising process performance.
  • 2016 Introduced ILC-V inner layer preclean process that allows for excellent dry film adhesion to very low-profile copper surfaces without microetching or roughening the copper prior to lamination.
  • 2018 Introduced ILC-PF, a phosphate-free version of ILC-V, to meet reduced phosphate discharge limits in several areas of North America.
  • 2020 Acquired by Redfern Companies. Rebranded the complete company as Focus Tech, Inc.
  • 2022 Moved to 47,000 square foot facility in Tempe, Arizona with multimillion dollar capital investment to improve and streamline all operational, research & development and manufacturing processes.
  • Blending capacity was increased from 2 x 2,000-gallon blending tanks to 1×2000 and 2 x 3,000-gallon tanks.
  • Increased raw material storage. Added 1 x 4,900 gallon and 2 x 6,000-gallon bulk storage tanks.
  • Increased finished goods capacity by 40%.
  • Full-service R&D laboratory that can assist customers in product development:             

   • Wet titration
   • Atomic absorption spectroscopy
   • UV/VIS spectroscopy
   • Viscosity
   • Percent solids
   • pH, ORP and conductivity
   • Cross sections
   • Scanning electron microscope and energy dispersive x-ray analysis