FOCUSTECH™ Solutions
About FOCUSTECH™
We are a world-class chemical manufacturer that also happens to manufacture the industry-leading line of process control systems.
We create custom formulations to meet customer or supplier requirements. Primarily servicing the PCB, GMF, and Chem Milling industries.
Beyond our well-established stable of existing products, we take pride in our ability to quickly and effectively formulate custom products for customer-specific applications.
Anti-Foam
A highly active surfactant that works at very low concentrations and is free rinsing. AF-5 is a high molecular weight block copolymer formulation that is the industry standard for dry film processing antifoams.
An outstanding antifoam that is exceptionally effective in photoresist developing and stripping applications.
Silicone emulsion that is particularly useful in waste treatment applications. AF-20 works at very low dosage rates making it extremely economical to use.
Anti-Tarnish
Citric acid and triazole solution designed to prevent copper oxidation, improve dry film adhesion and preserve the surface for subsequent processing.
Triazole solution designed to prevent copper oxidation, improve dry film adhesion and preserve the surface for subsequent processing.
"Concentrated anti-tarnish designed to preserve cleaned copper surfaces and prevent re-oxidation prior to subsequent processing. Excellent non-flammable replacement for Cu-56."
Copper Cleaners
Alkaline cleaner designed to clean copper surfaces. ALC-1 completely removes resist residues, heavy oils and finger prints.
Non-etching, dual-acid cleaner formulated to completely remove conversion coatings as well as light oils and fingerprints.
Tri-acid cleaner with a very mild etch for removing conversion coatings, oxidation stains, light oils and fingerprints.
Dual-acid cleaner formulated specifically to provide improved dry film adhesion to Very Low Profile (VLP) copper foils, especially when used in conjunction with DuPont’s YieldMaster® 2000 Wet Lamination System.
Tri-acid cleaner formulated to provide improved dry film adhesion to Very Low Profile (VLP) copper foils, especially when used in conjunction with DuPont’s YieldMaster® 2000 Wet Lamination System. ILC-PF is phosphate-free for facilities with reduced or zero phosphate discharge limits.
Pre-plate cleaner that provides a mild and consistent etch rate over the life of the bath.
Copper Thinning/Half Etch
Hydrogen peroxide/sulfuric acid copper etching process designed to rapidly and evenly reduce copper foil thickness prior to fine line etching operations.
Cupric and Ferric Chloride Etch
Sodium chlorate/sodium chloride-based cupric and ferric chloride etchant regenerator formulated specifically for colorimetric control systems.
Sodium chlorate based cupric and ferric chloride etchant regenerator with proprietary banking agents that provide an improved etch factor.
Acidic equipment cleaner designed specifically to clean soot and residue from ferric chloride etching systems that process carbon steel.
Dry Film Adhesion Promoters
A highly concentrated, acid cleaner designed to completely remove chromate conversion coatings and improve dry film photoresist adhesion. PC-1531 removes light oils and fingerprints and leaves the copper surface resistant to oxidation.
Dry Film/Soldermask Developer
450 g/L developer concentrate designed for use in photoresist and solder mask developing processes. Formulated using detergent additives, working solutions of DV-6450 can be made using tap water with up to 400 ppm of dissolved solids without forming a significant hardness scale.
Concentrated developer solution designed specifically for replenishment of steady state developing processes. DV-6450R provides over three times the loading of standard carbonate developing processes without compromising product quality or throughput.
600 g/L potassium carbonate developer concentrate designed for use in photoresist and solder mask developing processes. DV-6600 contains cleaner additives that significantly reduce residue and water hardness scale buildup in the process equipment.
Dry Film Resist Stripper
Cost effective caustic/MEA based photoresist stripper designed specifically for print-and-etch stripping applications.
Photoresist stripper designed for print-and-etch stripping applications, but it is also an excellent general-purpose stripper well suited for processes that run both inner and outer layer parts.
Very low VOC dry film stripper designed specifically for print-and-etch applications. FS-68/IL can significantly reduce VOC emissions.
Photoresist stripper formulated to break etch resist into very small piece sizes and aid in removal from fine and/or overplated features without the use of glycol ethers (solvents). Also available as a starter solution with a reduced pH to prevent tin attack during startup.
Semi-aqueous photoresist stripper formulated specifically to strip dry film from between very fine lines and underneath overplated features. No product on the market produces a smaller stripped particle than FS-79/OL.
Equipment Cleaner
Alkaline cleaner formulated for developing, etching, resist stripping and tin stripping processes.
Aggressive solvent/alkaline cleaner excellent for removing tenacious photoinitiator sludge and residues from dry film developing and stripping processes.
Mild organic acid cleaner designed to remove photoinitiator sludge from dry film developing and stripping processes.
Hot Air Solder Level & Hot Oil Reflow
Low viscosity hot air solder leveling flux designed specifically for vertical processes. VHF-202 removes light copper oxides and promotes excellent solderability.
Low acid hot oil reflow flux designed with superior wetting to provide excellent solder coverage with a bright, shiny finish.
Heat transfer fluid for use in immersion reflow of plated solder. HOR-210 has excellent thermal stability and is completely water soluble for easy rinsing.
Cleaner designed to neutralize flux activators and completely remove all flux residues. FC-220 brightens and helps protect the solder finish.
Hydrochloric acid/thiourea-based solder brightener/conditioner designed for immersion or spray applications. SB-260 deoxidizes and brightens solder etch resists after etching and conditions the plated solder to provide superior reflow characteristics.
Micro Etch
Catalysed peroxide/sulfuric microetch designed to provide a significantly rougher surface when compared to traditional peroxide/sulfuric microetches.
Stabilized powder persulfate microetch that simply outperforms all other proprietary powdered microetches.
Oxide Alternative
Super concentrated microetch additive designed to promote innerlayer bonding. Resin Bond 320 provides excellent bond strength across a wide range of resin systems.
Pumice
Acid-activated, 3F pumice that chemically removes copper oxidation and imparts anti-tarnish properties on the copper surface. AP-580 can be used in automatic or hand scrubbing operations.
Acid-activated, 3F pumice that chemically removes copper oxidation and imparts anti-tarnish properties on the copper surface. For use only in hand scrubbing operations.
Screening Products
Cured solder mask stripper is formulated to quickly and cleanly strip most cured solder masks with minimal effort. Typical cleaning cycles are less than one hour and require little to no scrubbing.
Free rinsing, biodegradable screen cleaner formulated to effectively remove uncured solder masks and legend inks from screens and parts.
Free rinsing, biodegradable screen cleaner that quickly removes uncured solder masks and legend inks from screens and parts.
Emulsion remover formulated to effectively remove inks and emulsions from screens. ER-425 is a non-flammable and non-hazardous based formulation that contains no VOCs.
Tin/Solder Stripper
Reduced sludge tin stripper that quickly removes etch resists leaving a uniform surface with minimal copper attack.
High-loading tin stripper that removes etch resists quickly and cleanly and leaves the underlying copper surface with a bright, uniform finish.
High-loading ammonium bifluoride/hydrogen peroxide-based tin/solder
stripper.
Waste Treatment
Sodium dimethyl dithiocarbamate-based waste treatment additive for precipitating metal ions. MC-9210 provides a safe, cost-effective means for removing heavy metals from chelated and non-chelated waste streams.
Sulfide-free, proprietary waste treatment additive for precipitating heavy metal ions. MP-9220 reduces copper, tin, nickel, and lead to their pure metallic form resulting in dense filter cakes of very high metal concentrations with no risk of hydrogen sulfide gas releases.
Proprietary formulation designed to precipitate dry film photoresist from spent resist stripping solutions. RESIStreat RT-9225 detacifies precipitated resist sludge so that it is easily dewatered in a standard filter press.
Calcium polysulfide-based waste treatment additive for precipitating metal ions.